| General high-temperature masking | Polyimide film with a heat-resistant silicone adhesive | 25–50 µm | Silicone | Approximately −60 to 200 °C | Good resistance to many solvents, oils, and dilute acids; test against strong alkalis and concentrated chemicals | Typically 4–7 kV per 25 µm, depending on film and construction | Choose for broad temperature exposure, clean edges, and reliable removal after thermal processing |
| Soldering and reflow-process masking | Thin polyimide film designed for short high-temperature exposure | 25–50 µm | Thermosetting silicone | Approximately 180–260 °C continuous; short-term exposure may be higher | Generally resistant to solder flux residues and common cleaning solvents; confirm compatibility with the specific flux and cleaner | Typically 4–7 kV per 25 µm | Prioritize dimensional stability, low adhesive transfer, and removal without lifting components or leaving residue |
| High-voltage electrical insulation | Thicker polyimide film, often used as a multi-layer wrap or with an insulating backing | 50–125 µm | Silicone or acrylic, selected according to temperature and aging requirements | Approximately −40 to 155 °C, depending on the adhesive system | Good resistance to moisture and many industrial fluids; evaluate long-term exposure to oils, solvents, and refrigerants | Commonly about 5–10 kV per 25 µm for the film; system performance depends on thickness, voids, and overlap | Specify dielectric strength, insulation resistance, thickness tolerance, edge protection, and required safety margin |
| Transformer, motor, and coil wrapping | Flexible polyimide electrical tape with controlled thickness and strong conformability | 25–75 µm | Heat-resistant silicone or electrical-grade acrylic | Approximately 130–200 °C, based on the complete tape system | Good resistance to varnishes and many electrical insulating fluids; verify compatibility with the impregnation process | Typically 4–8 kV per 25 µm | Match the tape’s thermal class, tensile strength, elongation, and adhesive stability to the winding process |
| Chemical-processing or solvent exposure | Polyimide film with a low-residue silicone adhesive; use a fluoropolymer-laminated construction when required | 50–125 µm | Silicone or fluoropolymer-compatible adhesive | Approximately −60 to 200 °C for common silicone systems | Polyimide generally resists many hydrocarbons, alcohols, and moderate solvents; strong acids, strong bases, and prolonged immersion require testing | Typically 4–8 kV per 25 µm | Check immersion time, concentration, temperature, swelling, adhesive softening, and residue after chemical contact |
| Low-temperature or cryogenic masking | Flexible polyimide film with an adhesive formulated for low-temperature tack | 25–50 µm | Low-temperature silicone | Approximately −60 to 150 °C | Good resistance to moisture and many common chemicals; confirm adhesion after thermal cycling | Typically 4–7 kV per 25 µm | Evaluate initial tack, flexibility, shrinkage, and clean removal after repeated cooling and warming cycles |
| Clean-room and residue-sensitive masking | Low-outgassing polyimide film with a controlled-residue silicone adhesive | 25–50 µm | Low-outgassing silicone | Approximately 150–200 °C | Good resistance to common cleaning solvents; verify ionic contamination, outgassing, and extractables for the process | Typically 4–7 kV per 25 µm | Request particle, outgassing, ionic cleanliness, and adhesive-transfer data when contamination control is critical |
| Permanent bonding at moderate temperature | Polyimide film with a higher-shear acrylic adhesive | 25–75 µm | Acrylic | Approximately −40 to 150 °C; some formulations reach about 180 °C | Good resistance to aging, ultraviolet exposure, and many chemicals; performance varies with solvent and temperature | Typically 4–7 kV per 25 µm | Use when long-term adhesion, shear strength, and resistance to oxidation are more important than easy removal |
| Very thin, conformable insulation | Thin polyimide film with a thin, uniform adhesive coating | 12.5–25 µm | Silicone or acrylic | Approximately 120–180 °C, depending on adhesive type | Generally good resistance to common solvents; thinner constructions provide less protection against mechanical damage and chemical attack | Typically 2–6 kV per 25 µm | Select when space is limited, but confirm puncture resistance, dielectric margin, handling strength, and edge coverage |
| Important: The values shown are typical selection ranges for generic polyimide tape constructions, not guaranteed specifications. Actual performance depends on film grade, adhesive formulation, thickness, dwell time, pressure, surface condition, voltage waveform, and environmental exposure. Always verify the manufacturer’s technical data and test the tape under the intended operating conditions. |